PS6 & NEXT-GEN CUSTOM AMD RDNA5 CHIP ARCHITECTURE LEAKED

Internal supply chain documents originating from semiconductor foundries in Hsinchu confirm that Sony Interactive Entertainment has finalized the primary silicon architecture for its next-generation home console—projected internally under the codename "Project Orion" (commonly understood as PlayStation 6).

The RDNA5 Microchip Breakthrough

Unlike the monolithic die used in the base PS5 and PS5 Pro, the PS6 silicon leverages a modular Chiplet Architecture on a 2nm foundry process. This configuration splits compute units into dedicated Graphics Compute Dies (GCD) paired with an independent AI Neural Processing Engine.

SPECIFICATION	PS5 PRO (CURRENT REVISION)	PROJECT ORION (PS6 LEAK)
Architecture	Custom RDNA 3.5 / Zen 2	Custom RDNA 5 / Zen 6 Chiplet
Process Node	4nm TSMC	2nm TSMC Advanced Node
AI Super-Sampling	PSSR v1.0	PSSR v3.0 Hardware Tensor Cores
Target Output	4K 60 FPS Dynamic	4K 120 FPS Native Path Tracing

Ray Tracing Acceleration & Neural Super Resolution

The most striking revelation in the decrypted documents is the presence of dedicated Intersection Engine Accelerators inside every compute unit. This architecture promises true real-time Path Tracing without frame-rate hits, powered directly by third-generation PlayStation Spectral Super Resolution (PSSR v3.0).

Official developer kits are expected to circulate to tier-1 Sony partner studios by late Q4 2026, setting the stage for a commercial hardware rollout in late 2027 or early 2028.